CONFERENCE SCOPE:
New trends in nanoelectronics
INSTITUTION:
Portland State University, USA
TITLE:
Can Unique Thermal Challenges of Monolithic 3D ICs be addressed with 2D Materials?
ABSTRACT:
Neuromorphic systems emulating the human brain and using non-von Neumann architectures that perform calculations “within memory” is an example of the next generation of computing that require performance well beyond current circuits. Current technologies are evolving into CFETs (Complementary Field Effect Transistors) with transistors stacked vertically, placed on top of each other by creatively integrating both nFET and pFET nano-wires in a single stacked structure. Monolithic 3D (M3D) systems that are fabricated using CFETs deliver lower leakage, increased performance, and significant area reduction at constant gate dimensions. Unfortunately, power density increases by the same factor. The very dense and specific integration scheme of M3Ds creates unique challenges for thermal management and specifically for dissipating heat. The different tiers are separated by very thin inter-layer dielectrics (ILD), which poorly facilitate lateral heat spread. It presents a much bigger challenge than 3D systems using TSVs (Through-Silicon-Vias) that have the thick bonding layers and bulk substrate. Various 2D materials offer promising solutions to improve heat dissipation and are considered as thermal interface materials (TIMs), additional intermediate layers (ILs), and interlayer dielectrics (ILD). Thermal simulators are used to investigate various materials and their influence on temperature maps and temperature range distributions in 3D ICs.
BIO:
Malgorzata Chrzanowska-Jeske is a Professor at the Electrical and Computer Engineering Department at Portland State University, and was department chair 2004-2010. She earned her M.S. from the Technical University of Warsaw, Poland, and her PhD in Electrical Engineering from Auburn University.
Her most recent research interests include traditional and AI-based CAD for physical design and thermal management of VLSI 3D ICs, and statistical design of emerging nanodevice based computing systems.
She serves on the editorial boards of IEEE TNANO, IOP Nano Express, Foundations and Trends in Integrated Circuits and Systems and has served on others like IEEE TCAS II and IEEE JETCAS. She has given numerous Plenary, keynote, and tutorial lectures at various IEEE conferences worldwide and published in prestigious international journals and conferences. In 2008 she received the IEEE CEDA Donald O. Pederson Best Paper Award. She has served on IEEE CASS Board of Governors and on Steering and Organizing Committees of many IEEE CASS and NTC conferences. Currently, she serves as IEEE Nanotechnology Council VP for Finances.